To hit the flagship market, 4nm Meizu 19 PRO mobile phone enters the trial production stage

Once upon a time, Meizu system can be said to be the leader of domestic systems, but with the departure of designers, it has become unsustainable. While other friends are working hard to release 4nm flagship new phones, Meizu is also preparing silently. According to netizens, Meizu 19 Pro will be officially available soon.

This time, the Meizu 19 Pro is no longer conservative, and the front of the fuselage adopts an off-screen camera design. Not only that, Meizu 19 Pro will also launch a 4K screen, which supports 120Hz adaptive rate high refresh rate. The display effect is more delicate and the fluency is extremely smooth. It is definitely a high-quality screen.
For battery life, Meizu 19 Pro should not have much upgrades in order to take into account the design concept of small beauty, but it has made a lot of progress in fast charging, supporting 80W super fast charging, and realizing fast full-blooded resurrection. Compared with the previous generation, Meizu 19Pro has indeed made a lot of changes this time. If it can compete like Motorola in terms of pricing, then sales will not be a problem at all.

Be mentally prepared! The basic models of the iPhone 14 series may still use the A15 chip

After the release of the new generation of iPhone SE, the iPhone 14 series, as the next new phone to be released by Apple, naturally attracted attention. By convention, the entire iPhone 14 series will be equipped with the A16 bionic chip, but the performance may be different. But the latest news suggests that this year Apple may break with tradition.

According to news on March 14, Ming-Chi Kuo, a well-known analyst at Tianfeng International Securities, recently tweeted that the basic iPhone 14 model released this year may still be equipped with the A15 chip used in the iPhone 13 series. He believes that this year’s iPhone 14 series does not have a 5.4-inch mini model, and Apple has made a new division of its product specifications: iPhone 14, iPhone 14 Max, iPhone 14 Pro and iPhone 14 Pro Max. Among them, the 6.1-inch iPhone 14 and iPhone 14 Max will continue to use the A15 bionic chip, while the 6.7-inch iPhone 14 Pro and iPhone 14 Pro Max will be equipped with new chips.
It’s not the first time Apple has done this. The iPhone 5S launched in 2013 was powered by the A7 chip, while the iPhone 5C was powered by the A6 chip.

Not only the chip configuration is different, but the appearance of each model of the iPhone 14 series may also be different. According to previous reports, the iPhone 14 Pro series may use an “exclamation mark” hole-digging design, while the basic iPhone 14 model still uses a notch design.

Samsung Galaxy M53 5G benchmark exposure: MediaTek Dimensity 900 + 6GB RAM

Recently, the Samsung Galaxy M53 5G mobile phone running score was exposed in the GeekBench benchmark library, and the model shows the model number “SM-M536B”.

Under the GeekBench 5 benchmark, the Galaxy M53 5G scored 733 points for single-core and 2,224 points for multi-core. In addition, this phone is also equipped with 6GB of memory, which is basically enough to meet our daily needs. Judging from the parameters of the running library, the phone is equipped with MediaTek Dimensity 900 octa-core SoC, with a base clock frequency of 2.0GHz, and runs the Android 12-based OneUI 4 system.

It is understood that the Galaxy M series focuses on cost performance, offering impressive hardware specifications at a reasonable price. The previous generation Galaxy M52 5G uses a 6.7-inch AMOLED screen with a refresh rate of 120Hz, and is equipped with Qualcomm Snapdragon 778G SoC, the main camera is 64MP, and the battery capacity is 5000mAh, which has a good battery life.

New MacBook Air may be released this year with M2 chip and new design

Recently, some media broke the news that Apple is developing an iteration of the M1 chip, which is likely to be called the “M2 chip”. It is reported that products including the new MacBook Air and the new 13-inch MacBook will use this chip with a high probability, and both devices will be released later this year.

Among these new products, the new MacBook Air is obviously more interesting. In addition to carrying the M2 chip, this device will also feature a new design. It has been previously reported that the new MacBook Air has a colorful body design similar to the iMac, and has a more square appearance. In addition, the new MacBook Air is expected to be equipped with a “notch screen” with a higher screen-to-body ratio.
Another M2 chip is likely to be the 13-inch MacBook. This device does not appear to be the thin and light notebook of its time, but a product with the same design as the 13-inch MacBook Pro, and this product is also expected to debut at the same time as the MacBook Air.

It is understood that the new M2 chip will most likely use the same 8-core CPU as the M1 chip, but the chip will most likely have 9-core and 10-core GPUs to meet the needs of different consumers.

TSMC plans to increase the 8-inch mature process foundry quotation, 12-inch is still under evaluation

The global semiconductor shortage has become the norm. Due to tight production capacity, the foundry fees of some wafer foundries have also risen again and again.

On March 9, according to a report from Taiwan’s “Electronic Times”, some IC designers said that TSMC plans to increase the foundry quotation of 8-inch mature processes in the third quarter, while 12-inch mature and advanced processes are still under evaluation. In September last year, TSMC notified customers that foundry prices for all chips would increase by up to 20%. Among them, the price of sub-7nm process technology will increase by 3%-10%, and the price of mature process above 12nm will increase by 20%.
Another report said that the 8-inch capacity of most wafer foundries is still tight, and capacity expansion is even more unlikely. Some analysts pointed out that in the future, insufficient production capacity of 8 inches will become the norm in the industry.
It is understood that the downstream of the 8-inch wafer covers power management chips (PMIC), CMOS image sensor chips, fingerprint identification chips, display driver ICs, radio frequency chips, and power devices, while the 12-inch wafer covers AI chips. , SoC, GPU, memory and other consumer electronics fields. At present, the production capacity of the former is tight and the supply is in short supply; the production capacity of the latter has been relieved to a certain extent.