Since TSMC announced in February that Denso Corporation of Japan has invested in a stake, TSMC’s factory in the Japanese joint venture is already in the construction stage, and the construction will be completed by September next year. Then it will enter the installation and commissioning stage of the equipment to prepare for the foundry of wafers.
According to the news disclosed by TSMC, it plans to start shipping in December 2024, using 22nm and 28nm processes to manufacture wafers for related customers, with a planned monthly production capacity of 45,000 12-inch wafers. After the news of Denso’s investment and shareholding came out, TSMC’s factory in the Japanese joint venture will increase the 12 and 16nm process technology, and the monthly production capacity will also increase to 55,000 12-inch wafers.
When it was announced in November last year, TSMC disclosed that Sony planned to inject $500 million into the joint venture and obtain no more than 20% of the shares.
On the 15th of last month, TSMC announced on its official website that Denso Japan will invest $350 million in their joint venture with Sony to acquire more than 10% of the shares. TSMC will still hold most of the shares of the joint venture. Investment in the factory will rise to $8.6 billion.